Table of contents

The following topics are dealt with: 3D chip testing; automatic test equipment; board-level testing; built-in self-test; defect oriented testing; design for testability; diagnosis and debug; embedded core testing; hardware security; high-speed interface testing; interconnect characterization; memory testing; mixed-signal/analog testing; nanometer technology testing; on-line and field testing; performance/delay testing; microprocessor testing; power issues in testing; system-level test economics; test synthesis; test resource partitioning; test related standards; verification and validation; wafer testing and yield optimization.