Title :
Analysis of thermal interface resistivity of a helix TWT slow-wave structure
Author :
Han, Yong ; Liu, Yan-Wen ; Ding, Yao-Gen ; Liu, Pu-Kun
Author_Institution :
Key Lab. of High Power Microwave Sources & Technol., Chinese Acad. of Sci., Beijing, China
Abstract :
The thermal interface resistivity (TIR) of the helix slow-wave structure (SWS) is studied theoretically and experimentally. The effects of the TIRs at different interfaces on heat dissipation capability of the SWS have been analyzed and compared using ANSYS. The TIRs at the helix-rod interface and the rod-barrel interface have been calculated respectively with the developed equations and the measured component temperatures, considering the temperature- -dependent material properties. The effects of the rod material and the assembly method on the TIRs of the SWS were analyzed and compared.
Keywords :
cooling; slow wave structures; ANSYS; heat dissipation capability; helix TWT; slow-wave structure; thermal interface resistivity; Assembly; Difference equations; Electromagnetic heating; Laboratories; Material properties; Microwave technology; Power supplies; Temperature measurement; Thermal conductivity; Thermal resistance; Heat dissipation capability; Slow-wave structure; Thermal interface resistivity;
Conference_Titel :
Vacuum Electronics Conference, 2009. IVEC '09. IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3500-5
Electronic_ISBN :
978-1-4244-3501-2
DOI :
10.1109/IVELEC.2009.5193384
