Analysis of thermal interface resistivity of a helix TWT slow-wave structure

Author

Han, Yong ; Liu, Yan-Wen ; Ding, Yao-Gen ; Liu, Pu-Kun

Author_Institution

Key Lab. of High Power Microwave Sources & Technol., Chinese Acad. of Sci., Beijing, China

fYear

2009

fDate

28-30 April 2009

Firstpage

114

Lastpage

115

Abstract

The thermal interface resistivity (TIR) of the helix slow-wave structure (SWS) is studied theoretically and experimentally. The effects of the TIRs at different interfaces on heat dissipation capability of the SWS have been analyzed and compared using ANSYS. The TIRs at the helix-rod interface and the rod-barrel interface have been calculated respectively with the developed equations and the measured component temperatures, considering the temperature- -dependent material properties. The effects of the rod material and the assembly method on the TIRs of the SWS were analyzed and compared.

Keywords

cooling; slow wave structures; ANSYS; heat dissipation capability; helix TWT; slow-wave structure; thermal interface resistivity; Assembly; Difference equations; Electromagnetic heating; Laboratories; Material properties; Microwave technology; Power supplies; Temperature measurement; Thermal conductivity; Thermal resistance; Heat dissipation capability; Slow-wave structure; Thermal interface resistivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Vacuum Electronics Conference, 2009. IVEC '09. IEEE International

Conference_Location

Rome

Print_ISBN

978-1-4244-3500-5

Electronic_ISBN

978-1-4244-3501-2

Type

conf

DOI

10.1109/IVELEC.2009.5193384

Filename

5193384