DocumentCode :
2810902
Title :
Analysis of ground bond wire arrays for RFICs
Author :
Patterson, H.
Author_Institution :
Motorola Inc., Tempe, AZ, USA
fYear :
1997
fDate :
10-10 June 1997
Firstpage :
237
Lastpage :
240
Abstract :
This paper outlines a method for rapid computation of the inductance of arrays of ground bond wires for RFICs, thus saving a designer considerable time over using inaccurate empirical equations or slowly converging electromagnetic simulators. Results comparable in accuracy to a fully detailed PEEC electromagnetic simulation are shown.
Keywords :
arrays; inductance; integrated circuit modelling; integrated circuit technology; lead bonding; PEEC electromagnetic simulation; RFIC; design; ground bond wire array; inductance; Bonding; Equations; Image segmentation; Inductance; Length measurement; Microscopy; Radiofrequency integrated circuits; Skin effect; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-4063-9
Type :
conf
DOI :
10.1109/RFIC.1997.598796
Filename :
598796
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2810902
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