• DocumentCode
    2811890
  • Title

    Radic: A standard-cell-based sensor for on-chip aging and flip-flop metastability measurements

  • Author

    Xiaoxiao Wang ; Tran, Duke ; George, Saly ; Winemberg, LeRoy ; Ahmed, Nova ; Palosh, Steve ; Dobin, Allan ; Tehranipoor, Mohammad

  • fYear
    2012
  • fDate
    5-8 Nov. 2012
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    As process technology further scales, aging, noise and variations in integrated circuits (ICs) and systems become a major challenge to both the semiconductor and EDA industries, since a significantly increased mismatch is emerging between modeled and actual silicon behavior. Therefore, the addition of accurate and low-cost on-chip sensors is of great value to reduce the mismatch. This paper presents a standard-cell-based, novel, and accurate sensor for reliability analysis of digital ICs (Radic), in order to better understand the characteristics of gate/path aging and process variations´ impact on timing performance. The Radic sensor performs aging, flip-flop (FF) metastability window and variation measurements on-chip. This sensor has been fabricated in a floating gate Freescale SOC in very advanced technology. The measurement results demonstrate that the resolution is better than 0.1ps, and the accuracy is kept throughout aging/process variation. Furthermore, reliability and FF metastability measurements are performed using the proposed sensor. The measurement results agree with the existing models.
  • Keywords
    ageing; flip-flops; integrated circuit reliability; logic testing; system-on-chip; Radic; flip-flop; integrated circuits; metastability measurements; mismatch; on-chip aging; reliability; standard-cell-based sensor; Aging; Clocks; Frequency measurement; Logic gates; Radiation detectors; Semiconductor device measurement; System-on-a-chip; Aging Sensor; Frequency/delay Sensor; HCI; Metastability Window Measurement; NBTI; On-Chip Structure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2012 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4673-1594-4
  • Type

    conf

  • DOI
    10.1109/TEST.2012.6401593
  • Filename
    6401593