DocumentCode
2812563
Title
LTCC 3D integration platform for microwave and millimeter wave modules
Author
Vaha-Heikkila, T. ; Lahti, M.
Author_Institution
VTT Tech. Res. Centre of Finland, Espoo, Finland
fYear
2012
fDate
21-23 Nov. 2012
Firstpage
95
Lastpage
97
Abstract
This paper introduces Low Temperature Co-Fired Ceramics (LTCC) technology platform which is an integration platform for multi chip modules. LTCC platform is also well suited for the realization of antenna arrays, filters and other passives from RF to millimeter wave frequencies. Examples of realized components and modules are presented in the paper.
Keywords
antenna accessories; ceramic packaging; microwave antenna arrays; millimetre wave antenna arrays; millimetre wave integrated circuits; three-dimensional integrated circuits; LTCC 3D integration platform; RF; antenna arrays; low temperature cofired ceramics technology; microwave modules; millimeter wave frequencies; millimeter wave modules; multichip modules; Decision support systems; Radio frequency; 3D integration; LTCC; System-in-package; antennas; filters; modules;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio-Frequency Integration Technology (RFIT), 2012 IEEE International Symposium on
Conference_Location
Singapore
Print_ISBN
978-1-4673-2303-1
Type
conf
DOI
10.1109/RFIT.2012.6401625
Filename
6401625
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