DocumentCode
2813165
Title
Accelerated temperature cycle test and Coffin-Manson model for electronic packaging
Author
Cui, Helen
Author_Institution
RF Micro Devices, Greensboro, NC, USA
fYear
2005
fDate
Jan. 24-27, 2005
Firstpage
556
Lastpage
560
Keywords
Weibull distribution; cracks; electronics packaging; failure analysis; life testing; reliability; stress analysis; Coffin-Manson model; Weibull analysis; accelerated reliability testing; accelerated temperature cycle test; activation energy; electronic packaging; failure analysis; mechanical cracks; product reliability; root cause failure mechanism; solder fatigue; stress level; Consumer electronics; Data analysis; Electronic equipment testing; Electronics packaging; Failure analysis; Fatigue; Life estimation; Radio frequency; Stress; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium, 2005. Proceedings. Annual
ISSN
0149-144X
Print_ISBN
0-7803-8824-0
Type
conf
DOI
10.1109/RAMS.2005.1408421
Filename
1408421
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