Effect of annealing on adhesion for Ti/Ni/Ag electrodes

Author

Wu, Jun ; Zheng, Liang ; Deng, Jiangxia ; Qin, Huibin ; Ying, Zhihua ; Xiang, Weiguang

Author_Institution

Inst. of Electron Device & Applic., Hangzhou Dianzi Univ., Hangzhou, China

fYear

2011

fDate

15-17 July 2011

Firstpage

4941

Lastpage

4943

Abstract

Compared with traditional single nickel layer electrode, multilayers electrode for backside chips of power devices has higher thermal and electrical reliability. In this paper, Ti/Ni/Ag metal trilayers were deposited on single crystal silicon (111) substrates by DC magnetron sputtering technique. The effect of thermal treatment on adhesion strength of multilayers electrodes was investigated with the help of SEM, XRD, AFM, and EDX measurement. The analysis results showed that the annealing temperature and time had strong influence on adhesion. The optimal annealing conditions were 600 °C for 60 min. Samples treated under the conditions exhibited the highest adhesion strength of 134.4 N/cm² with more smooth surface and higher metallization degree, which fits for the requirement of the general power devices.

Keywords

X-ray chemical analysis; X-ray diffraction; adhesion; annealing; atomic force microscopy; electrochemical electrodes; metallic thin films; metallisation; multilayers; nickel; scanning electron microscopy; silver; sputter deposition; surface roughness; titanium; AFM; DC magnetron sputtering; EDX; SEM; Si; Ti-Ni-Ag; X-ray diffraction; XRD; adhesion strength; annealing effect; atomic force microscopy; backside chips; electrical reliability; energy dispersive X-ray analysis; metal film trilayers; metallization; multilayers electrode; power devices; scanning electron microscopy; single crystal silicon (111) substrates; surface smoothness; temperature 600 degC; thermal reliability; thermal treatment; time 60 min; Adhesives; Annealing; Electrodes; Nickel; Silicon; X-ray scattering; Ti/Ni/Ag; adhesion; annealing; metal electrode;

fLanguage

English

Publisher

ieee

Conference_Titel

Mechanic Automation and Control Engineering (MACE), 2011 Second International Conference on

Conference_Location

Hohhot

Print_ISBN

978-1-4244-9436-1

Type

conf

DOI

10.1109/MACE.2011.5988123

Filename

5988123