Title :
Working with nine different foundries
Author :
Stoneham, E.B. ; O´Sullivan, P.A.J. ; Mitchell, S.W. ; Podell, A.F.
Author_Institution :
Pacific Monolithics, Sunnyvale, CA, USA
Abstract :
Experience in channeling MMIC designs through processes in several foundries has led the authors to insights into impediments faced by the GaAs industry. Problems affecting chip performance have been due primarily to variables not subject to foundry specifications. These problems include backgating, substrate oscillations, photosensitivity, large-signal discrepancies, and the post-process problems that follow front-side processing. Barring these problems, the cost of chips for high-volume analog applications is most strongly affected by design rules and specification tolerances.<>
Keywords :
III-V semiconductors; MMIC; gallium arsenide; integrated circuit technology; semiconductor technology; GaAs industry; MMIC designs; backgating; cost of chips; design rules; front-side processing; high-volume analog applications; impediments; large-signal discrepancies; photosensitivity; post-process problems; semiconductors; several foundries; specification tolerances; substrate oscillations; Capacitance; Costs; FETs; Fabrication; Foundries; Gallium arsenide; Impedance; MODFET circuits; Phase change materials; Process design;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1990. Technical Digest 1990., 12th Annual
Conference_Location :
New Orleans, LA, USA
DOI :
10.1109/GAAS.1990.175434
