Title :
Development of new Pb-free solder alloy of Sn-Ag-Bi system
Author :
Habu, Kazutaka ; Takeda, Naoko ; Watanabe, Haruo ; Ooki, Hiroshi ; Abe, Jiro ; Saito, Takashi ; Taniguchi, Yoshikuni ; Takayama, Kinjiro
Author_Institution :
Res. Center, Sony Corp., Yokohama, Japan
Abstract :
New solder alloys are now being developed to find Pb-free alternatives to conventional lead-based solder for environmental reasons. The authors have developed a novel lead-free solder made up of tin, silver, bismuth, copper, and germanium with the composition Sn-2.0Ag-4.0Bi-0.5Cu-0.1Ge. The small amount of germanium drastically improves the solderability and the reliability of the Sn-Ag-Bi system. The new solder is usable in conventional soldering equipment
Keywords :
bismuth alloys; copper alloys; environmental factors; germanium alloys; reliability; silver alloys; soldering; tin alloys; SnAgBiCuGe; SnAgBiCuGe Pb-free solder alloy; environmentally-friendly solder; reliability; solderability; Bismuth; Cooling; Copper alloys; Environmentally friendly manufacturing techniques; Germanium alloys; Lead; Pollution measurement; Temperature; Time measurement; Tin;
Conference_Titel :
Electronics and the Environment, 1999. ISEE -1999. Proceedings of the 1999 IEEE International Symposium on
Conference_Location :
Danvers, MA
Print_ISBN :
0-7803-5495-8
DOI :
10.1109/ISEE.1999.765841
