Title :
A package design for ultra-high speed GaAs integrated circuits
Author :
Kamada, C. ; Nakazato, N. ; Hatta, Y. ; Mitsusada, K. ; Takai, A.
Author_Institution :
Hitachi Ltd., Tokyo, Japan
Abstract :
A new 20-pin IC package is developed for use in 2.4 Gb/s optical transmission systems. The optimum structure of the high-speed signal transmission lines is designed using three-dimensional reactance calculation and circuit simulation. Metallization by cavity casting is applied to coplanar ground lines. This reduces the inductance of the transmission lines and improves isolation characteristics. Terminal loads at the distal end of the transmission lines are controlled by three means: resistors, a high-pass filter and a low-pass filter. The electrical performances of the 2.4 Gbit/s GaAs analog IC modules achieve satisfactory flat frequency response.<>
Keywords :
III-V semiconductors; analogue circuits; gallium arsenide; monolithic integrated circuits; packaging; 2.4 Gbit/s; GaAs; IC package; analog IC modules; cavity casting; circuit simulation; coplanar ground lines; distal end; flat frequency response; high-pass filter; high-speed signal transmission lines; isolation characteristics; low-pass filter; metallisation; optical transmission systems; package design; three-dimensional reactance calculation; Circuit simulation; Coplanar transmission lines; Distributed parameter circuits; Gallium arsenide; High speed optical techniques; Integrated circuit packaging; Low pass filters; Optical filters; Photonic integrated circuits; Signal design;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1990. Technical Digest 1990., 12th Annual
Conference_Location :
New Orleans, LA, USA
DOI :
10.1109/GAAS.1990.175488
