DocumentCode
2816694
Title
Resonator miniaturization for oscillators
Author
Hsu, Wan-Thai
Author_Institution
Discera Inc., Ann Arbor, MI
fYear
2008
fDate
19-21 May 2008
Firstpage
392
Lastpage
395
Abstract
This paper first compares the trends and the challenges of miniaturization for silicon micro-electromechanical system (MEMS) resonators and quartz crystals. Core resonators are compared in terms of electrical parameters, frequency definitions and tolerances, temperature compensation. As packaging occupies much larger area than core resonators, miniaturization of packaging is also discussed.
Keywords
crystal oscillators; electronics packaging; micromechanical resonators; silicon; MEMS resonators; electrical parameters; frequency definitions; oscillators; packaging miniaturization; quartz crystal oscillators; resonator miniaturization; silicon microelectromechanical system resonators; temperature compensation; tolerances; Circuits; Costs; Crystals; Electronics packaging; Frequency; Manufacturing; Microelectromechanical systems; Micromechanical devices; Oscillators; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium, 2008 IEEE International
Conference_Location
Honolulu, HI
ISSN
1075-6787
Print_ISBN
978-1-4244-1794-0
Electronic_ISBN
1075-6787
Type
conf
DOI
10.1109/FREQ.2008.4623026
Filename
4623026
Link To Document