Title :
Resonator miniaturization for oscillators
Author_Institution :
Discera Inc., Ann Arbor, MI
Abstract :
This paper first compares the trends and the challenges of miniaturization for silicon micro-electromechanical system (MEMS) resonators and quartz crystals. Core resonators are compared in terms of electrical parameters, frequency definitions and tolerances, temperature compensation. As packaging occupies much larger area than core resonators, miniaturization of packaging is also discussed.
Keywords :
crystal oscillators; electronics packaging; micromechanical resonators; silicon; MEMS resonators; electrical parameters; frequency definitions; oscillators; packaging miniaturization; quartz crystal oscillators; resonator miniaturization; silicon microelectromechanical system resonators; temperature compensation; tolerances; Circuits; Costs; Crystals; Electronics packaging; Frequency; Manufacturing; Microelectromechanical systems; Micromechanical devices; Oscillators; Silicon;
Conference_Titel :
Frequency Control Symposium, 2008 IEEE International
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-1794-0
Electronic_ISBN :
1075-6787
DOI :
10.1109/FREQ.2008.4623026
