DocumentCode
2816721
Title
Induction planar actuator: An analytical, numerical and experimental study
Author
Filho, Aly F Flores ; Filho, Nolvi F Baggio
Author_Institution
Post-Grad. Programme in Electr. Eng., Fed. Univ. of Rio Grande do Sul, Porto Alegre, Brazil
fYear
2010
fDate
8-10 Nov. 2010
Firstpage
1
Lastpage
6
Abstract
The electromagnetic structure of the proposed induction planar actuator (IPA) comprehends a static ferromagnetic core with an aluminium slab as secondary, and a primary moving part called mover. The latter is fitted with three-phase orthogonal windings assembled on a slotted core that produces a linearly moving magnetic field. The interaction between the magnetic field and the electrical currents induces on the secondary due to that field results in a traction force on the mover the pushes it over the working plan of the actuator accordingly. Also, a normal force takes place and loads the linear bearings and supporting rails. The 3D flux density distribution of the actuator suggests the employment of a grain-insulated soft magnetic composite to reduce eddy currents and losses on the core. Flux density, traction and normal forces are studied by means of an analytical model proposed, with the aid of a finite element model and with the experimental test obtained from a prototype. The results present a good agreement and corroborate the feasibility of such actuator.
Keywords
electromagnetic actuators; finite element analysis; magnetic flux; soft magnetic materials; 3D flux density distribution; aluminium slab; eddy currents; electrical currents; electromagnetic structure; finite element model; grain insulated soft magnetic composite; induction planar actuator; linear bearings; linearly moving magnetic field; mover; normal force; slotted core; static ferromagnetic core; supporting rails; three phase orthogonal windings; traction force; Actuators; Coils; Force; Iron; Magnetic fields; Magnetic flux density;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications (INDUSCON), 2010 9th IEEE/IAS International Conference on
Conference_Location
Sao Paulo
Print_ISBN
978-1-4244-8008-1
Electronic_ISBN
978-1-4244-8009-8
Type
conf
DOI
10.1109/INDUSCON.2010.5739942
Filename
5739942
Link To Document