Title :
Thermal analysis using finite difference techniques [electronic systems design]
Author_Institution :
Dynamics Div., BAe plc, Bristol, UK
Abstract :
In recent years, the advent of miniature high powered electronic systems, the new technology of the space industry and the ever increasing drive towards greater reliability have resulted in the need for careful appraisal of the thermal management of heat dissipating systems. To aid the process thermal analysis finite difference programs have been developed. These have included the European Space Agency Thermal Analysis Network (ESATAN) software package and more recently the Program for Modelling and Electronic Thermal Evaluation (PROMETHEE) software package. The use of such techniques early in the design process can be used to appraise: (1) optimum design solutions, including the choice of cooling method; (2) manufacturing methods, and (3) performance and reliability. The author details the features of the two packages and their PCB modelling capability
Keywords :
circuit CAD; circuit analysis computing; difference equations; electronic engineering computing; packaging; printed circuit design; reliability; software packages; thermal analysis; ESATAN; European Space Agency Thermal Analysis Network; PCB modelling; PROMETHEE; Program for Modelling and Electronic Thermal Evaluation; cooling method; finite difference techniques; heat dissipating systems; manufacturing methods; optimum design solutions; performance evaluation; reliability; software package; thermal analysis; thermal management;
Conference_Titel :
Thermal Design of Electronic Systems, IEE Colloquium on
Conference_Location :
London
