DocumentCode :
281733
Title :
Thermal design of aerospace systems
Author :
Landeg, D.R.
Author_Institution :
Dynamics Div., BAe plc, Bristol, UK
fYear :
1989
fDate :
32596
Firstpage :
42522
Lastpage :
42524
Abstract :
As a result of successful efforts to improve electronic circuit performance, the power densities of components have increased significantly. These trends have to be matched by improvements in thermal management and cooling techniques if higher operating temperatures and poorer reliability are to be avoided. The author describes one of the most challenging thermal problems: the cooling of a military system in a hostile natural environment and he emphasises the importance of a multi-disciplinary, analytical approach to the complete system thermal design at an early stage of the project
Keywords :
aerospace; cooling; military systems; packaging; aerospace systems; cooling techniques; hostile natural environment; military system; thermal design; thermal management;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Thermal Design of Electronic Systems, IEE Colloquium on
Conference_Location :
London
Type :
conf
Filename :
198144
Link To Document :
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