• DocumentCode
    2817479
  • Title

    Investigation of 6T SOI SRAM Cell Stability Including Quantum and Gate Direct Tunneling Effects by Three-dimensional Device Simulation

  • Author

    Tanabe, R. ; Tosaka, Y. ; Ashizawa, Y. ; Oka, H.

  • Author_Institution
    Fujitsu Laboratories Ltd. Fuchigami 50, Akiruno, Tokyo, 197-0833 Japan. E-mail: tanabe.ryou@jp.fujitsu.com
  • fYear
    2005
  • fDate
    01-03 Sept. 2005
  • Firstpage
    43
  • Lastpage
    46
  • Abstract
    This paper shows the impacts of the tunneling leakage current and quantum effect on Static Noise Margin (SNM) and soft error phenomenon for 6T type SOI SRAM by direct 3D process and devise simulations. Below 1.0 nm gate oxide thickness, the influence on SRAM SNM cannot be negligible. Soft error calculations for SOI SRAM cell show SOI devices are very strong for α-particle injections, but for heavy-ion injections, soft error might occur easily and both quantum and tunneling leakage current effects should be considered for accurate future scaled SRAM cell simulation.
  • Keywords
    CMOS technology; Circuit simulation; Leakage current; MOS devices; Poisson equations; Random access memory; Stability; Tunneling; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2005. SISPAD 2005. International Conference on
  • Print_ISBN
    4-9902762-0-5
  • Type

    conf

  • DOI
    10.1109/SISPAD.2005.201468
  • Filename
    1562020