• DocumentCode
    2817556
  • Title

    Effect of Mo layer on performance of AlN/Si SAW filter

  • Author

    Trang Hoang ; Rey, Patrice ; Vaudaine, M.-H. ; Robert, Philippe ; Benech, Ph

  • Author_Institution
    Heterogeneous Silicon Integration Dept., CEA/LETI, Grenoble
  • fYear
    2008
  • fDate
    19-21 May 2008
  • Firstpage
    615
  • Lastpage
    618
  • Abstract
    This paper presents the effect of Mo thin layer on performance of AIN/Si SAW filter. This purpose is done by comparison between AIN/Mo/Si and AIN/Si SAW devices. The texture of AlN film is strongly influenced by the texture and roughness of the Si substrate and by the bottom Mo electrodes. The texture of AlN is evaluated by the full-width at half-maximum (FWHM) of x-ray rocking curves (XRD). The FWHM of AlN films are measured in different thicknesses of AlN films, with and without bottom Mo layer. Network analyzer HP 8753E is used for analysis of SAW filters performance. The influences of Mo layer on performance of SAW filter are analysed by model, simulation of SAW filter, by characterization of fabricated different devices. Using Mo layer below AlN would have subjects of interest which include increasing the gain of filter, saving die area that is the important and interesting application.
  • Keywords
    III-V semiconductors; aluminium compounds; elemental semiconductors; molybdenum; network analysers; silicon; surface acoustic wave filters; thin film devices; wide band gap semiconductors; AlN-Mo-Si; FWHM; SAW devices; SAW filter; X-ray rocking curves; die area; film texture; full-width half-maximum; molybdenum thin layer; network analyzer HP 8753E; silicon substrate roughness; Electrodes; Fingers; Frequency; Performance analysis; SAW filters; Substrates; Surface acoustic wave devices; Surface acoustic waves; Surface morphology; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium, 2008 IEEE International
  • Conference_Location
    Honolulu, HI
  • ISSN
    1075-6787
  • Print_ISBN
    978-1-4244-1794-0
  • Electronic_ISBN
    1075-6787
  • Type

    conf

  • DOI
    10.1109/FREQ.2008.4623073
  • Filename
    4623073