DocumentCode :
2818210
Title :
Comparison of Different Approaches for the Simulation of Topography Evolution during Lithography Development
Author :
Schnattinger, T. ; Bär, E.
Author_Institution :
Fraunhofer Institute of Integrated Systems and Device Technology (IISB), Schottkystrasse 10,91058 Erlangen, Germany. thomas.schnattinger@iisb.fraunhofer.de
fYear :
2005
fDate :
01-03 Sept. 2005
Firstpage :
215
Lastpage :
218
Abstract :
Different algorithms for simulating topography evolution are compared in 2D and 3D, using rates for a lithography development process as a bench-marking example. The methods studied are the cell removal, the string, and the fast-marching algorithm. Issues considered are the convergence of the extracted critical dimensions of resist layers with increasing resolution of the simulation grid and the computation time and its dependence on the resolution. Furthermore, it is shown that a slicewise 2D simulation of topography evolution for a 3D structure is not capable of correctly representing the evolving 3D shape of the resist.
Keywords :
Chromium; Computational modeling; Convergence; Grid computing; Inhibitors; Lithography; Resists; Spatial resolution; Stability; Surface topography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2005. SISPAD 2005. International Conference on
Print_ISBN :
4-9902762-0-5
Type :
conf
DOI :
10.1109/SISPAD.2005.201511
Filename :
1562063
Link To Document :
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