• DocumentCode
    2818524
  • Title

    A Study of Dynamic Welding of Electrical Contacts with Emphasis on the Effects of Oxide Content for Silver Tin Indium Oxide Contacts

  • Author

    Chen, Z.K. ; Witter, G.J.

  • Author_Institution
    Chugai USA LLC, Waukegan, IL, USA
  • fYear
    2010
  • fDate
    4-7 Oct. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The processes involved with dynamic welding of contacts are discussed and two different welding mechanisms are identified from work using a very sensitive model switch. One mechanism forms weak welds by cold bonding freshly arced surfaces and the other mechanism involves bonds formed by short arc melting of the contact surface. Using the model switch, silver tin indium oxide contacts having different percentages of oxides are studied to compare the dynamic welding properties. The results show a large decrease in weld strength as the oxide level increases from 15% to 22% by volume. The work also shows that, for contact make, contact closing force has a major effect on welding with contact weld strengths increasing as contact force decreases.
  • Keywords
    bonding processes; electrical contacts; indium compounds; melting; silver compounds; tin compounds; welding; cold bonding; dynamic welding; electrical contact; oxide content; short arc melting; silver tin indium oxide contact; Contacts; Force; Materials; Silver; Switches; Tin; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts (HOLM), 2010 Proceedings of the 56th IEEE Holm Conference on
  • Conference_Location
    Charleston, SC
  • ISSN
    1062-6808
  • Print_ISBN
    978-1-4244-8174-3
  • Type

    conf

  • DOI
    10.1109/HOLM.2010.5619552
  • Filename
    5619552