DocumentCode
2818628
Title
Quantum Chemical Molecular Dynamics Analysis of the Effect of Intrinsic Defects and Strain on Dielectric Characteristic of Gate Oxide Films
Author
Suzuki, Ken ; Ito, Yuta ; Miura, Hideo
Author_Institution
Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-716 Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan, Email: kn@rift.mech.tohoku.ac.jp
fYear
2005
fDate
01-03 Sept. 2005
Firstpage
327
Lastpage
330
Abstract
In order to make clear the effect of strain and intrinsic defects in SiO2 on both its electronic and structural characteristics, we performed a quantum chemical molecular dynamics analysis for SiO2-X , structure under strain. The band gap of SiO2 changes significantly by the deformation of the Si-O-Si bond angle due to the applied strain. The crystallographic structure of the SiO2-x deforms drastically because the Si-O bonds neighboring an oxygen vacancy are broken and a free silicon monoxide molecule is generated in the SiO2-x structure. The magnitude of the band gap of the SiO2-x decreases from 8.9 eV to 6.3 eV due to the change in the atomic configuration accompanying the diffusion of the free monoxide. In addition, the band gap decreases further under large tensile strain. We can conclude, therefore, that both the existence of oxygen vacancies and tensile strain in SiO2-x films deteriorate the electronic reliability of the oxide film seriously.
Keywords
Bonding; Capacitive sensors; Chemical analysis; Crystallography; Dielectrics; Performance analysis; Photonic band gap; Semiconductor films; Silicon; Tensile strain;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2005. SISPAD 2005. International Conference on
Print_ISBN
4-9902762-0-5
Type
conf
DOI
10.1109/SISPAD.2005.201539
Filename
1562091
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