DocumentCode :
2820446
Title :
Breakdown voltage behavior of PET thermoplastics at DC and AC voltages
Author :
Grzybowski, S. ; Feilat, E.A. ; Knight, P. ; Doriott, L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Mississippi State Univ., MS, USA
fYear :
1999
fDate :
1999
Firstpage :
284
Lastpage :
287
Abstract :
The demand on thermoplastic encapsulation of coils and electronic devices has been increased recently as an alternative to thermosets for electrical insulation, heat dissipation and physical protection of the encapsulated devices from harsh environmental operating conditions. Compared with thermosets, thermoplastics offer excellent electrical properties, superior surface hardness, excellent dimensional stability and good chemical and heat resistance. This paper presents a Weibull statistical analysis of breakdown voltages of PET thermoplastics polyester cups used for encapsulating high voltage coils. The behavior of the polyester cups at DC and AC voltages and under dry and wet conditions is demonstrated. It was found in this work that the DC breakdown voltage of the polyester cups are much higher than the AC breakdown voltage under dry conditions. On the other hand, under wet conditions the DC breakdown voltage significantly decreased in comparison with the AC breakdown voltage. Moreover, it was found that the DC breakdown voltages are widely scattered in comparison with the AC breakdown voltages. It was also found that the statistical behavior of the DC breakdown voltages under wet conditions follow a mixed Weibull distribution. It is believed that this behavior is attributed to the presence of technical defects in some cups such as microvoids
Keywords :
Weibull distribution; coils; electric breakdown; encapsulation; insulator testing; moisture; plastics; polymer insulators; statistical analysis; AC voltages; DC voltages; HV coils; PET thermoplastics; Weibull statistical analysis; breakdown voltage behavior; dry conditions; electrical insulation; encapsulated devices; harsh environmental operating conditions; heat dissipation; high voltage coils; microvoids; mixed Weibull distribution; physical protection; polyester cups; polyethylene terephthalate; technical defects; thermoplastic encapsulation; wet conditions; Chemicals; Coils; Dielectrics and electrical insulation; Electric resistance; Encapsulation; Positron emission tomography; Protection; Resistance heating; Surface resistance; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Southeastcon '99. Proceedings. IEEE
Conference_Location :
Lexington, KY
Print_ISBN :
0-7803-5237-8
Type :
conf
DOI :
10.1109/SECON.1999.766141
Filename :
766141
Link To Document :
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