DocumentCode :
2821243
Title :
The fabrication of electrical linewidth structures capable of TEM measurement using standard ⟨100⟩ wafers
Author :
Munro, C.G. ; Gundlach, A.M. ; Stevenson, J.T.M. ; Travis, D.W. ; Smith, S. ; Rankin, N.S. ; Walton, A.J.
Author_Institution :
Dept. of Electr. Eng., Edinburgh Univ., UK
fYear :
1999
fDate :
1999
Firstpage :
13
Lastpage :
17
Abstract :
This paper presents details of a process for fabricating electrical linewidth structures over etched windows so that they potentially can be inspected with a TEM. These ELISTEMs (electrical linewidth structures for TEM) are fabricated using standard ⟨100⟩ silicon wafers. Measurements are compared with those obtained for conventional linewidth structures
Keywords :
elemental semiconductors; etching; inspection; integrated circuit interconnections; integrated circuit measurement; integrated circuit testing; silicon; transmission electron microscopy; ELISTEMs; Si; TEM inspection; TEM measurement; electrical linewidth structure fabrication; electrical linewidth structures; electrical linewidth structures for TEM; etched windows; linewidth structures; measurements; standard ⟨100⟩ silicon wafers; standard Si⟨100⟩ wafers; Aluminum; Buildings; Costs; Dry etching; Electric variables measurement; Fabrication; Measurement standards; Resists; Silicon; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1999. ICMTS 1999. Proceedings of the 1999 International Conference on
Conference_Location :
Goteborg
Print_ISBN :
0-7803-5270-X
Type :
conf
DOI :
10.1109/ICMTS.1999.766208
Filename :
766208
Link To Document :
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