DocumentCode :
2821653
Title :
Energy and thermal aware buffer cache replacement algorithm
Author :
Yue, Jianhui ; Zhu, Yifeng ; Cai, Zhao ; Lin, Lin
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Maine, Orono, ME, USA
fYear :
2010
fDate :
3-7 May 2010
Firstpage :
1
Lastpage :
10
Abstract :
Power consumption is an increasingly impressing concern for data servers as it directly affects running costs and system reliability. Prior studies have shown most memory space on data servers are used for buffer caching and thus cache replacement becomes critical. Temporally concentrating memory accesses to a smaller set of memory chips increases the chances of free riding through DMA overlapping and also enlarges the opportunities for other ranks to power down. This paper proposes a power and thermal-aware buffer cache replacement algorithm. It conjectures that the memory rank that holds the most amount of cold blocks are very likely to be accessed in the near future. Choosing the victim block from this rank can help reduce the number of memory ranks that are active simultaneously. We use three real-world I/O server traces, including TPC-C, LM-TBF and MSN-BEFS to evaluate our algorithm. Experimental results show that our algorithm can save up to 27% energy than LRU and reduce the temperature of memory up to 5.45°C with little or no performance degradation.
Keywords :
cache storage; microprocessor chips; power aware computing; power consumption; DMA overlapping; I/O server traces; LM-TBF server trace; MSN-BEFS server trace; TPC-C server trace; buffer caching; cache replacement algorithm; cold blocks; data servers; energy aware buffer cache; memory chips; power consumption; thermal aware buffer cache; Clustering algorithms; Costs; Degradation; Energy consumption; Energy efficiency; Energy management; Read-write memory; Temperature; Thermal engineering; Throughput; Buffer cache; data servers; memory energy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mass Storage Systems and Technologies (MSST), 2010 IEEE 26th Symposium on
Conference_Location :
Incline Village, NV
Print_ISBN :
978-1-4244-7152-2
Electronic_ISBN :
978-1-4244-7153-9
Type :
conf
DOI :
10.1109/MSST.2010.5496982
Filename :
5496982
Link To Document :
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