Title :
Non destructive evaluation in micro dimensions
Author :
Meyendorf, Norbert
Author_Institution :
Dayton Univ., OH, USA
Abstract :
Characteristics of defects with micro and nanometer sizes, local variations in material properties, and localized strains and deformations are critical for predicting the reliability of microelectronic devices, MEMS and nanostructured material systems. Microscopic, nondestructive evaluation methods are capable of detecting near surface defects of nanometer size. The presentation will give an overview of microscopic NDE methods and show examples of scanning probe, acoustic, thermal and optical microscopy.
Keywords :
acoustic microscopy; deformation; internal stresses; micromechanical devices; nanostructured materials; nondestructive testing; optical microscopy; reliability; scanning probe microscopy; MEMS; acoustic microscopy; deformations; localized strains; microdimensions; microelectronic devices; microscopic NDE methods; nanometer sizes; nanostructured material systems; nondestructive evaluation; nondestructive testing; optical microscopy; reliability; scanning probe microscopy; surface defects; thermal microscopy; Acoustic signal detection; Capacitive sensors; Material properties; Materials reliability; Microelectronics; Micromechanical devices; Nanoscale devices; Nanostructured materials; Optical microscopy; Probes;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN :
0-7803-7066-X
DOI :
10.1109/DTIP.2003.1286998
