Non destructive evaluation in micro dimensions

Author

Meyendorf, Norbert

Author_Institution

Dayton Univ., OH, USA

fYear

2003

fDate

5-7 May 2003

Firstpage

3

Abstract

Characteristics of defects with micro and nanometer sizes, local variations in material properties, and localized strains and deformations are critical for predicting the reliability of microelectronic devices, MEMS and nanostructured material systems. Microscopic, nondestructive evaluation methods are capable of detecting near surface defects of nanometer size. The presentation will give an overview of microscopic NDE methods and show examples of scanning probe, acoustic, thermal and optical microscopy.

Keywords

acoustic microscopy; deformation; internal stresses; micromechanical devices; nanostructured materials; nondestructive testing; optical microscopy; reliability; scanning probe microscopy; MEMS; acoustic microscopy; deformations; localized strains; microdimensions; microelectronic devices; microscopic NDE methods; nanometer sizes; nanostructured material systems; nondestructive evaluation; nondestructive testing; optical microscopy; reliability; scanning probe microscopy; surface defects; thermal microscopy; Acoustic signal detection; Capacitive sensors; Material properties; Materials reliability; Microelectronics; Micromechanical devices; Nanoscale devices; Nanostructured materials; Optical microscopy; Probes;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on

Print_ISBN

0-7803-7066-X

Type

conf

DOI

10.1109/DTIP.2003.1286998

Filename

1286998