Title :
Understanding faulty behavior of a peristaltic micropump
Author :
Knight, M. ; Kaminska, Bozena ; House, J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon Health & Sci. Univ., Beaverton, OR, USA
Abstract :
The effects of process parameters, specifically those related to silicon wet etch and metal deposition, on the performance of the microheaters in a peristaltic microfluidic pump are presented. The thermal resistance of the microheaters is strongly dependent upon the relative thermal isolation, which impacts maximum pumping speed (from a few Hertz to kilo-Hertz). Thermal isolation is shown to not be an issue in the pump design given the spacing of the neighboring microheaters.
Keywords :
elemental semiconductors; etching; microactuators; microfluidics; micropumps; silicon; thermal resistance; faulty behavior; metal deposition; microheaters; peristaltic microfluidic pump; peristaltic micropump; relative thermal isolation; silicon wet etch; thermal isolation; thermal resistance; Atomic force microscopy; Biomembranes; Chemical sensors; Etching; Infrared heating; Microfluidics; Micropumps; Silicon; Thermal resistance; Valves;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN :
0-7803-7066-X
DOI :
10.1109/DTIP.2003.1287005
