Abstract :
Rajeev Ram serves as Program Director at ARPA-E where he works to select, manage and define new research program opportunities in support of the ARPA-E mission. His primary focus at ARPA-E is in advanced electrical components and systems ranging from transportation to the generation and transmission of electric power. He has worked in the areas of semiconductor devices, microscopic heat transfer, and bioprocess development for much of his career. In the early 1990´s, he developed the III–V wafer bonding technology that led to the fist telecom wavelength surface-emitting laser and record brightness light emitting devices at Hewlett-Packard Laboratory in Palo Alto.
