DocumentCode
2823511
Title
Combating the erosion of manufacturing - a partnership product design, development and deployment strategy (P2D3)
Author
Spowage, A.C. ; Passey, S.J. ; Bin, Song ; Sun, Jian Min ; Chandrasekaran, M.
Author_Institution
Singapore Inst. of Manuf. Technol., Singapore
Volume
3
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
1037
Abstract
The economies of developed countries face a major challenge in combating the erosion of established manufacturing capability. This is also true for Singapore´s manufacturing base. This paper proposes a partnership approach to developing and maintaining a high value added product development capability. A particular focus is on the small & medium enterprise (SME) base. A fast-track feasibility assessment approach is proposed and combined with a range of proven quality tools and techniques for taking product ideas through to a production status. Effective partnership with other organisations, suppliers, peer manufacturers, public research bodies, is seen as key to providing the wide range of complementary capabilities needed which otherwise would not be available within a typical SME. The paper identifies a number of metrics needed to support such a fast track feasibility assessment approach and an associated process workflow. A flexible skills resource base is advocated but utilising a core team to see through projects which are assessed as viable.
Keywords
product design; product development; research and development; small-to-medium enterprises; deployment strategy; development strategy; fast track feasibility assessment approach; feasibility assessment approach; manufacturing capability; manufacturing erosion; partnership product design; product development capability; small & medium enterprise; Acceleration; Costs; Manufacturing industries; Milling machines; Product design; Product development; Production; Productivity; Research and development; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering Management Conference, 2004. Proceedings. 2004 IEEE International
Print_ISBN
0-7803-8519-5
Type
conf
DOI
10.1109/IEMC.2004.1408849
Filename
1408849
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