DocumentCode :
2823897
Title :
Building empirical model through simulation - a case study
Author :
Tan, C.M. ; Can, Z.H.
Author_Institution :
Sch. of EEE, Nanyang Technol. Univ., Singapore
Volume :
3
fYear :
2004
fDate :
18-21 Oct. 2004
Firstpage :
1090
Abstract :
Simulation and design of experiment are commonly used in engineering design and optimization today. In this work, we apply the methodology of the design of experiment and response surface method to finite element analysis for the building of an empirical model. This eliminates the need for expensive resources to carry out the actual experiments. The developed empirical model enables us to obtain global optimization of a design. To further reduce the resources needed for the development of the model, Draper-Lin small-composite design is used, as it requires the minimum number of "experimental run". However, the design produces an accurate model. We present a modification method to improve the model developed, making it accurate for the optimization of our device design.
Keywords :
design engineering; design of experiments; finite element analysis; integrated circuit manufacture; optimisation; response surface methodology; empirical model optimization; engineering design; experiment design; finite element analysis; response surface method; Buildings; Computer aided software engineering; Design optimization; Finite element methods; Integrated circuit modeling; Residual stresses; Response surface methodology; Silicon on insulator technology; Temperature; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering Management Conference, 2004. Proceedings. 2004 IEEE International
Print_ISBN :
0-7803-8519-5
Type :
conf
DOI :
10.1109/IEMC.2004.1408860
Filename :
1408860
Link To Document :
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