Application of fuzzy linear regression in modeling epoxy dispensing process

This paper develops a process modeling method of epoxy dispensing for microchip encapsulation based on Tanaka´s fuzzy regression approach, in which the deviations between the observed values and the estimated values are expressed as the possibilities using fuzzy concept rather than statistical. In the paper, two kinds of fuzzy regression models for fill and dam processes of epoxy dispensing process, expressing the correlation between various process parameters and the two quality characteristics respectively, have been developed. Validation experiments have been performed to demonstrate the effectiveness of the process modeling method.