• DocumentCode
    2824506
  • Title

    Hot lot management: minimizing cycle time in batch processes

  • Author

    Gupta, A.K. ; Ganesan, V.K. ; Sivakumar, A.I.

  • Author_Institution
    Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
  • Volume
    3
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    1217
  • Abstract
    In semiconductor manufacturing, hot lots are often introduced into the system out of marketing and business considerations for extra flexibility regarding delivery lead times. The objective of this paper is to study the scheduling policies to minimize the cycle time of hot lots in batch processes. We present three scheduling policies based on look ahead batching (LAB) and study their effect on the performance of cycle time of hot lots and other priority lots in the system. In LAB, the scheduling decisions are based on the arrival epochs of incoming lots, which are easily predictable in a computer integrated manufacturing environment. The steady state simulation results show that exploiting the knowledge of future arrivals leads to 10% reduction in the cycle time of hot lots without affecting their standard deviation and also without affecting the cycle time performance of other priority lots in batch processes at lower values of utilization level.
  • Keywords
    batch processing (industrial); computer integrated manufacturing; production engineering computing; scheduling; semiconductor device manufacture; batch process; computer integrated manufacturing environment; cycle time minimization; hot lot management; look ahead batching; scheduling; semiconductor manufacturing; Computer integrated manufacturing; Control systems; Electronics industry; Fabrication; Furnaces; Job shop scheduling; Manufacturing processes; Processor scheduling; Semiconductor device manufacture; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering Management Conference, 2004. Proceedings. 2004 IEEE International
  • Print_ISBN
    0-7803-8519-5
  • Type

    conf

  • DOI
    10.1109/IEMC.2004.1408887
  • Filename
    1408887