• DocumentCode
    282451
  • Title

    Thermal management of electronic networks using TLM

  • Author

    Pulko, S.H. ; de Cogan, D.

  • Author_Institution
    Dept. of Electron. Eng., Hull Univ., UK
  • fYear
    1989
  • fDate
    32857
  • Firstpage
    42370
  • Lastpage
    42373
  • Abstract
    The heat transfer processes involved in the thermal management of electronic networks are complex. TLM (transmission line modelling) is an implementationally advantageous method of modelling heat transfer and related phenomena. The authors discuss the possibility and appropriateness of using the TLM technique to model aspects of heat dissipation in electronic networks. The following aspects of thermal effects in electronic networks are considered: modelling of heat transfer by conduction, convection and radiation, the incorporation of nonlinear thermal properties; the treatment of numerically stiff problems; modelling of forced air cooling; and modelling of changes of state
  • Keywords
    electronic engineering computing; heat transfer; thermal analysis; transmission lines; TLM technique; conduction; convection; electronic networks; forced air cooling; heat dissipation; heat transfer processes; nonlinear thermal properties; numerically stiff problems; radiation; thermal effects; thermal management; transmission line modelling;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Computer Aided Design Tools for Thermal Management, IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • Filename
    199183