Title :
Optimum wire shaping of an RLC interconnect
Author :
El-Moursy, Magdy A. ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
Abstract :
The optimum wire shape for minimum signal propagation delay across an RLC line is shown to have a general exponential form. The line inductance makes exponential tapering more attractive for RLC lines than for RC lines. For RLC lines, optimum wire tapering achieves a higher reduction in the signal propagation delay as compared to uniform wire sizing. Wire tapering can reduce both the propagation delay and power dissipation. A reduction of 15% in the propagation delay and of 16% in the power is achieved for an example circuit.
Keywords :
CMOS integrated circuits; RLC circuits; integrated circuit design; integrated circuit interconnections; CMOS integrated circuits; RLC circuits; RLC lines; integrated circuit interconnect; line inductance; minimum signal propagation delay; optimum wire shaping; power dissipation reduction; propagation delay reduction; wire tapering; Capacitance; Contracts; Inductance; Integrated circuit interconnections; Power dissipation; Propagation delay; RLC circuits; Repeaters; Shape; Wire;
Conference_Titel :
Circuits and Systems, 2003 IEEE 46th Midwest Symposium on
Print_ISBN :
0-7803-8294-3
DOI :
10.1109/MWSCAS.2003.1562571
