DocumentCode
2825525
Title
Liquid streaming and droplet formation caused by leaky Rayleigh waves
Author
Shiokawa, S. ; Matsui, Y. ; Ueda, T.
Author_Institution
Shizuoka Univ., Hamamatsu, Japan
fYear
1989
fDate
3-6 Oct 1989
Firstpage
643
Abstract
Various liquid motions such as streaming and droplet formation have been observed when a liquid was put on the surface of a SAW (surface acoustic wave) propagation substrate. Results of experimental and theoretical studies on these so-called SAW streaming phenomena are presented. Surface treatment of the SAW substrate by metallization and by silanization is employed to demonstrate that the liquid motion is strongly influenced by the chemical condition of the substrate surface. Experiments using 128° rotated Y -X LiNbO3 at 50 MHz with various pulse widths are described. In a hydrophilic case, such as an Al-deposited metal surface, the pattern of the SAW power flow can be observed. This indicates that one can quickly visualize the SAW radiation by merely putting a small volume of liquid on the surface. If the substrate surface is hydrophobic, small droplets are ejected from the water surface. Using this phenomenon makes it possible to develop new fluid devices. Theoretically, the SAW streaming force can be derived using the theory of acoustic streaming. The calculated SAW streaming force is found to be very large and strong enough to expel the droplet from the liquid surface
Keywords
Rayleigh waves; drops; surface acoustic waves; ultrasonic propagation; 50 MHz; Al-deposited metal surface; LiNbO3; SAW substrate; acoustic streaming; chemical condition; droplet formation; fluid devices; hydrophilic case; leaky Rayleigh waves; liquid motion; metallization; propagation substrate; silanization; streaming; surface acoustic wave; Acoustic devices; Acoustic propagation; Acoustic waves; Chemicals; Load flow; Metallization; Space vector pulse width modulation; Surface acoustic waves; Surface treatment; Visualization;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1989. Proceedings., IEEE 1989
Conference_Location
Montreal, Que.
Type
conf
DOI
10.1109/ULTSYM.1989.67063
Filename
67063
Link To Document