DocumentCode :
2826379
Title :
Polystyrene-Silver composites for embedded capacitor applications
Author :
Thomas, Dhanesh ; Sreelakshmi, K.P. ; Manu, K.M. ; Sebastian, M.T.
Author_Institution :
Mater. Div., Nat. Inst. for Interdiscipl. Sci. & Technol., Trivandrum, India
fYear :
2011
fDate :
18-22 Dec. 2011
Firstpage :
1
Lastpage :
4
Abstract :
The present paper reports the preparation and characterization of Polystyrene-Silver composites for embedded capacitor applications. The composites have been prepared by ultrasonic mixing followed by hot pressing. The percolation threshold is found to be decreasing from 0.1 Vf for silver of particle size <; 250 μm to 0.07 Vf for nano silver. The composites have temperature stable relative permittivity.
Keywords :
capacitors; filled polymers; hot pressing; particle size; permittivity; permittivity measurement; polymers; silver; Ag; embedded capacitor application; hot pressing; nanosilver; particle size; percolation threshold; permittivity; polystyrene-silver composite; ultrasonic mixing; Capacitors; Conductivity; Permittivity; Polymers; Powders; Silver; Embedded capacitor; conductivity; dielectric; nano-composite; percolation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Electromagnetics Conference (AEMC), 2011 IEEE
Conference_Location :
Kolkata
Print_ISBN :
978-1-4577-1098-8
Type :
conf
DOI :
10.1109/AEMC.2011.6256861
Filename :
6256861
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2826379
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