Title :
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects (IEEE Cat. No.04EX845)
Abstract :
The following topics are dealt with: simulation techniques for interconnect structures; analysis and modeling of power distribution networks; power/ground noise; time and frequency-domain measurements; coupling effects; macro-modeling; line parameter characteristics; optical interconnects and field theory; and modeling of packages and on-chip interconnects.
Keywords :
circuit simulation; frequency-domain analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; optical interconnections; time-domain analysis; coupling effects; field theory; frequency-domain measurements; interconnect structures; line parameter characteristics; macro-modeling; on-chip interconnects; optical interconnects; package modeling; power distribution network analysis; power distribution network modeling; power-ground noise; signal propagation; simulation techniques; time-domain measurements;
Conference_Titel :
Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
Conference_Location :
Heidelberg, Germany
Print_ISBN :
0-7803-8470-9
DOI :
10.1109/SPI.2004.1408976
