DocumentCode
2827058
Title
A new in-situ approach to flip-chip interconnect characterization up to millimeter wave frequencies
Author
Pfeiffer, Ullrich R. ; Chandrasekhar, Arun ; Zwick, Thomas
Author_Institution
T. J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
fYear
2004
fDate
9-12 May 2004
Firstpage
59
Lastpage
62
Abstract
In this paper we present the performance of flip-chip interconnects up to 40 GHz based on an alternative non-destructive measurement technique. The presented method unfolds the raw flip-chip interconnect, excluding any launch structures for an actually mounted silicon chip. A preliminary modeling approach for chip-package co-design is outlined.
Keywords
MIMIC; MMIC; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; alternative nondestructive measurement technique; chip-package co-design; flip-chip interconnect characterization; millimeter wave frequencies; silicon chip; Bonding; Coplanar waveguides; Frequency; Isolation technology; Measurement techniques; Millimeter wave measurements; Millimeter wave technology; Packaging; Semiconductor device measurement; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
Print_ISBN
0-7803-8470-9
Type
conf
DOI
10.1109/SPI.2004.1409004
Filename
1409004
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