DocumentCode
2827462
Title
Modeling capacitance of on-chip coplanar transmission lines over the silicon substrate
Author
Gordin, Rachel ; Goren, David
Author_Institution
IBM Haifa Res. Labs., Haifa Univ., Israel
fYear
2004
fDate
9-12 May 2004
Firstpage
117
Lastpage
120
Abstract
The paper presents a semi-analytical technique for modeling capacitance of on-chip coplanar transmission lines over conductive silicon substrate. The focus is put on developing expressions for high frequency capacitance which yield reasonable accuracy. The technique is based on the 2D approach and results in accurate and efficient expressions accounting for frequency dependent behavior of the silicon substrate, as well as for actual transmission lines geometry.
Keywords
capacitance; elemental semiconductors; integrated circuit interconnections; integrated circuit modelling; monolithic integrated circuits; silicon; transmission lines; capacitance modeling; conductive silicon substrate; frequency dependent behavior; high frequency capacitance; on-chip coplanar transmission lines; transmission lines geometry; Bandwidth; Capacitance; Conductors; Coplanar transmission lines; Dielectric losses; Dielectric substrates; Frequency; Predictive models; Silicon; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
Print_ISBN
0-7803-8470-9
Type
conf
DOI
10.1109/SPI.2004.1409023
Filename
1409023
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