DocumentCode :
2827462
Title :
Modeling capacitance of on-chip coplanar transmission lines over the silicon substrate
Author :
Gordin, Rachel ; Goren, David
Author_Institution :
IBM Haifa Res. Labs., Haifa Univ., Israel
fYear :
2004
fDate :
9-12 May 2004
Firstpage :
117
Lastpage :
120
Abstract :
The paper presents a semi-analytical technique for modeling capacitance of on-chip coplanar transmission lines over conductive silicon substrate. The focus is put on developing expressions for high frequency capacitance which yield reasonable accuracy. The technique is based on the 2D approach and results in accurate and efficient expressions accounting for frequency dependent behavior of the silicon substrate, as well as for actual transmission lines geometry.
Keywords :
capacitance; elemental semiconductors; integrated circuit interconnections; integrated circuit modelling; monolithic integrated circuits; silicon; transmission lines; capacitance modeling; conductive silicon substrate; frequency dependent behavior; high frequency capacitance; on-chip coplanar transmission lines; transmission lines geometry; Bandwidth; Capacitance; Conductors; Coplanar transmission lines; Dielectric losses; Dielectric substrates; Frequency; Predictive models; Silicon; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
Print_ISBN :
0-7803-8470-9
Type :
conf
DOI :
10.1109/SPI.2004.1409023
Filename :
1409023
Link To Document :
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