• DocumentCode
    2827462
  • Title

    Modeling capacitance of on-chip coplanar transmission lines over the silicon substrate

  • Author

    Gordin, Rachel ; Goren, David

  • Author_Institution
    IBM Haifa Res. Labs., Haifa Univ., Israel
  • fYear
    2004
  • fDate
    9-12 May 2004
  • Firstpage
    117
  • Lastpage
    120
  • Abstract
    The paper presents a semi-analytical technique for modeling capacitance of on-chip coplanar transmission lines over conductive silicon substrate. The focus is put on developing expressions for high frequency capacitance which yield reasonable accuracy. The technique is based on the 2D approach and results in accurate and efficient expressions accounting for frequency dependent behavior of the silicon substrate, as well as for actual transmission lines geometry.
  • Keywords
    capacitance; elemental semiconductors; integrated circuit interconnections; integrated circuit modelling; monolithic integrated circuits; silicon; transmission lines; capacitance modeling; conductive silicon substrate; frequency dependent behavior; high frequency capacitance; on-chip coplanar transmission lines; transmission lines geometry; Bandwidth; Capacitance; Conductors; Coplanar transmission lines; Dielectric losses; Dielectric substrates; Frequency; Predictive models; Silicon; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
  • Print_ISBN
    0-7803-8470-9
  • Type

    conf

  • DOI
    10.1109/SPI.2004.1409023
  • Filename
    1409023