• DocumentCode
    2828150
  • Title

    Characterization of via holes on printed circuit boards

  • Author

    Antonini, G. ; Lai, M. ; Orlandi, A. ; Ricchiuti, V.

  • Author_Institution
    Dept. of Electr. Eng., L´´Aquila Univ., Italy
  • fYear
    2004
  • fDate
    9-12 May 2004
  • Firstpage
    211
  • Lastpage
    214
  • Abstract
    When high speed digital signals propagate on printed circuit boards (PCBs), all the on board discontinuities are a concern for the electronic designers. Among them, the via holes, allowing the signals to jump from an external PCB layer to an internal one, are of paramount importance. The paper compares the transmission performances of three different kind of single ended and differential vias (through, blind and buried), providing the better solution for propagating high speed digital signals on a multi-layer PCB.
  • Keywords
    printed circuits; blind vias; board discontinuities; buried vias; differential vias; high speed digital signals; multilayer PCB; printed circuit boards; single ended vias; through vias; via holes; Bandwidth; Consumer electronics; Costs; Integrated circuit packaging; Knowledge based systems; Modems; Pins; Printed circuits; Scattering parameters; Signal design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
  • Print_ISBN
    0-7803-8470-9
  • Type

    conf

  • DOI
    10.1109/SPI.2004.1409055
  • Filename
    1409055