DocumentCode
2830370
Title
Influence of composition and texture on the thermoelectric and mechanical properties of extruded (Bi1-xSbx)2(Te1-ySey)3 alloys
Author
Simard, J.-M. ; Vasilevskiy, D. ; Turenne, S.
Author_Institution
5N Plus Inc, Montreal, Que., Canada
fYear
2003
fDate
17-21 Aug. 2003
Firstpage
13
Lastpage
18
Abstract
This paper presents the results obtained after five years of process development to produce bismuth telluride based thermoelectric alloys by powder consolidation approach. The synthesis of the alloys is obtained by mechanical alloying from pure elemental powders. Billets are then produced by cold pressing followed by hot extrusion in order to have a fully dense polycrystalline product with a crystal texture characterized by the c-axis aligned perpendicularly to the extrusion direction. Semiconductors of type-n and type-p were produced by carefully controlling the chemical composition of the alloys and the concentration of doping agents. The evolution of the thermoelectric properties is given as a function of the constituents contents of the alloy to determine an optimal composition that leads to maximum value of the figure of merit. The effect of texture is measured not only on the thermoelectric properties but also on the mechanical behaviour of the material.
Keywords
Seebeck effect; antimony compounds; bismuth compounds; electron mobility; extrusion; pressing; semiconductor materials; texture; thermoelectricity; (Bi1-xSbx)2(Te1-ySey)3; chemical composition; cold pressing; composition; doping agents concentration; extruded (Bi1-xSbx)2(Te1-ySey)3; fully dense polycrystalline product; hot extrusion; mechanical alloying; mechanical properties; powder consolidation approach; texture; thermoelectric; Alloying; Billets; Bismuth; Chemical elements; Lead; Mechanical factors; Powders; Pressing; Semiconductor device doping; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN
0-7803-8301-X
Type
conf
DOI
10.1109/ICT.2003.1287438
Filename
1287438
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