Title :
Reflow-solderable, low-profile (3 mm) STM-1 fiber-optic transmitter and receiver
Author :
Yoshida, T. ; Shuke, K. ; Kawatani, A. ; Matsumoto, K. ; Uda, Y.
Author_Institution :
NEC Corp., Kawasaki, Japan
Abstract :
Summary form only given. The STM-I transmitter and receiver pair was developed for automated reflow soldering assembly. Housings are 3-mm thin and electronic circuit operates on 3.3 V power supply compatible with peripheral LSIs. Reliability tests were carried out based on the Bellcore TA-NWT000983 requirements for the temperature cycle, vibration and shock tests, as well as the reflow-soldering performance. The results confirm the transmitter/receiver housings are soldered just like conventional surface-mount IC packages using automated reflow-soldering machines.
Keywords :
integrated circuit packaging; integrated circuit testing; large scale integration; optical receivers; optical transmitters; reflow soldering; reliability; 3 mm; 3.3 V; Bellcore TA-NWT000983 requirements; automated reflow soldering assembly; automated reflow-soldering machines; electronic circuit; peripheral LSIs; power supply; reflow-solderable low-profile STM-1 fiber-optic transmitter/receiver; reflow-soldering performance; reliability tests; shock tests; surface-mount IC packages; temperature cycle; transmitter/receiver housings; vibration; Assembly; Circuit testing; Electric shock; Electronic circuits; Integrated circuit packaging; Optical fiber testing; Power supplies; Reflow soldering; Temperature; Transmitters;
Conference_Titel :
Optical Fiber Communication Conference and Exhibit, 1998. OFC '98., Technical Digest
Conference_Location :
San Jose, CA, USA
Print_ISBN :
1-55752-521-8
DOI :
10.1109/OFC.1998.657321
