DocumentCode :
2831089
Title :
Plastic-package-type optoelectronic transmitter module using resinous sealing
Author :
Terashima, T.
Author_Institution :
Oki Electr. Ind. Co. Ltd., Tokyo, Japan
fYear :
1998
fDate :
22-27 Feb. 1998
Firstpage :
193
Lastpage :
194
Abstract :
Summary form only given. Summary form only given. The FTTH (fiber-to-the-home) optical access network for direct access between an office and users for mutual transmission of multimedia information through one optical fiber is predicted. For the implementation of FTTH, however, cost reduction on the ONU (optical network unit) to be installed at each subscriber is the most important task to be attained. Therefore, development of new optoelectronic technologies for cost reduction, downsizing and productivity improvement of optical modules is required. Because active alignment method to adjust the fiber position while driving the device has so far been the main technology for optical module assembly, there has been a certain limit in cost reduction because of the large number of components and required man-hours. From a reliability viewpoint, hermetically-sealed packages have been used to protect the devices from moisture and oxidation. However, the cost of a metallic or ceramic hermetically-sealed package is higher than non-hermetically-sealed packages. In this paper, we introduce component technologies making use of the passive alignment technique and report the optical characteristics of a plastic-package-type transmitter module using resinous sealing. This module, which consists of Si-V groove, LD (laser diode) and monitor PD (photodiode), is assembled using a passive-alignment technique. A 1.3 /spl mu/m LD, a single-mode fiber with a ferrule and a monitor PD are mounted on a Si substrate.
Keywords :
integrated optoelectronics; laser beam applications; modules; optical transmitters; plastic packaging; seals (stoppers); semiconductor lasers; 1.3 micron; FTTH optical access network; Si; Si substrate; Si-V groove; fiber-to-the-home; laser diode; monitor photodiode; optical characteristics; optoelectronic transmitter module; passive-alignment technique; plastic-package-type; resinous sealing; single-mode fibre; subscriber unit; Assembly; Costs; Monitoring; Optical devices; Optical fiber networks; Optical fiber subscriber loops; Optical fibers; Optical network units; Optical transmitters; Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical Fiber Communication Conference and Exhibit, 1998. OFC '98., Technical Digest
Conference_Location :
San Jose, CA, USA
Print_ISBN :
1-55752-521-8
Type :
conf
DOI :
10.1109/OFC.1998.657325
Filename :
657325
Link To Document :
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