DocumentCode :
2831820
Title :
Growth of thermoelectric Bi85Sb15 alloy thin films and their characterization by XRD, TEM & RBS
Author :
Mallik, Ramesh Chandra ; Rath, Satchidanand ; Das, V. Damodara
Author_Institution :
Dept. of Phys., Indian Inst. of Technol., Madras, India
fYear :
2003
fDate :
17-21 Aug. 2003
Firstpage :
363
Lastpage :
367
Abstract :
Bismuth and antimony are semimetals. The Bi(1-x)Sbx alloys (0.0485Sb15 alloy was prepared by the melt-quenching technique. The phase formation was confirmed by XRD. The thin films were prepared by the conventional flash evaporation technique to ensure stoichiometry and to avoid dissociation. The XRD, TEM and RBS studies were done for structural and compositional characterization of thin films. The results show that our method of preparation of bulk as well as thin films leads to no change in stoichiometry. The thicknesses of thin films as measured by the in-situ quartz crystal monitor and those evaluated from the RBS spectra agree well. The thermoelectric power measurements on thin films were made by the integral method and the data analyzed by the Jain-Verma theory to evaluate the power index in the energy dependent relaxation time, giving an idea about the nature of scattering. The detection of nature of scattering in the thin film material will help us to optimize the figure of merit and hence to enhance the thermoelectric properties.
Keywords :
Rutherford backscattering; Seebeck effect; X-ray diffraction; bismuth compounds; semiconductor thin films; stoichiometry; thermoelectricity; transmission electron microscopy; vacuum deposited coatings; Bi85Sb15; Jain-Verma theory; RBS; Seebeck coefficient; TEM; XRD; conventional flash evaporation technique; energy dependent relaxation time; figure of merit; melt-quenching technique; power index; stoichiometry; thermoelectric Bi85Sb15; thin films; Bismuth; Conducting materials; Equations; Scattering parameters; Semiconductor materials; Thermal conductivity; Thermoelectricity; Tin alloys; Transistors; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN :
0-7803-8301-X
Type :
conf
DOI :
10.1109/ICT.2003.1287523
Filename :
1287523
Link To Document :
بازگشت