Abstract :
Power semiconductor manufacturers are becoming increasingly aware that there is a need to have better models for their components for use with CAD analogue simulation tools such as the SPICE program developed originally by the University of California (Berkeley). This paper examines one family of devices, power MOSFETs, and describes some of the existing models which have been proposed in attempt to come to terms with the inadequacies of the ordinary SPICE 2 model for MOSFETs