DocumentCode :
2831975
Title :
Transport properties of polycrystalline Si0.8Ge0.2 thin films for micro power generators
Author :
Takashiri, M. ; Borca-Tasciuc, T. ; Olubuyide, O. ; Jacquot, A. ; Hoyt, J. ; Chen, G.
Author_Institution :
Dept. of Mech. Eng., MIT, Cambridge, MA, USA
fYear :
2003
fDate :
17-21 Aug. 2003
Firstpage :
395
Lastpage :
398
Abstract :
The transport properties of polycrystalline Si0.8Ge0.2 thin films are studied for their potential applications in micro power generators. These thin films are deposited by low-pressure chemical deposition (LPCVD). The doping is carried out by boron and phosphorus ion implantation, followed by annealing in nitrogen ambient. The concentration of boron and phosphorus 4.3x1019 cm-3, and 8.7x1019 cm-3, respectively. The thermoelectric transport properties of these thin films are measured, including electrical conductivity, Seebeck coefficient, and thermal conductivity. The electrical conductivity is measured by a 4 point-probe method. The Seebeck coefficient is measured by applying a temperature gradient along the in-plane direction, and evaluating the resulting voltage. The thermal conductivity is measured by a 3ω method in the cross-plane direction.
Keywords :
CVD coatings; Ge-Si alloys; Seebeck effect; boron; electrical conductivity; ion implantation; phosphorus; semiconductor thin films; thermal conductivity; thermoelectric conversion; thermoelectricity; LPCVD; Seebeck coefficient; Si0.8Ge0.2:B; Si0.8Ge0.2:P; annealing; doping; electrical conductivity; ion implantation; low-pressure chemical deposition; micro power generators; polycrystalline Si0.8Ge0.2 thin films; temperature gradient; thermal conductivity; transport properties; Boron; Chemicals; Conductivity measurement; Doping; Electric variables measurement; Ion implantation; Power generation; Semiconductor thin films; Sputtering; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN :
0-7803-8301-X
Type :
conf
DOI :
10.1109/ICT.2003.1287531
Filename :
1287531
Link To Document :
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