Optimization of a new thermoelectric cooling assembly using CFD analysis and local modeling of thermoelectric effects

A numerical model was developed to simulate the operation of a thermoelectric (TE) cooling assembly, comprising TE material, cold side heat-exchanger, hot side heat-sink and thermal impedances at each interface. A commercial code for computational-fluid-dynamics (CFD) was used to solve the thermo-fluid-dynamic fields and was coupled with one-dimensional model representing the TE interactions at the level of single TE couples. The results of CFD simulations on TE assemblies were validated with comparison to experimental data measured on a prototype working under the same operating conditions. The comparison was performed on a TE-block based on commercial TE cooling modules (TECM) and designed for modular TE cooling systems. The range of studied operating conditions covers the main applications of interest in the domestic cooling field. The model was then applied to represent a similar TE-block based on a new TECM with polymeric-film supports. Starting from same design specifications and using consistent amount and type of thermoelements, an optimization of the new design was performed varying the geometrical distribution of TE material between the cold side heat exchanger and the hot side heat sink.