DocumentCode :
2833398
Title :
Impact of screening of latent defects at electrical test on the yield-reliability relation and application to burn-in elimination
Author :
Van der Pol, Jacob A. ; Ooms, Eric R. ; Van ´t Hof, Toon ; Kuper, Fred G.
Author_Institution :
Waferfab AN, Philips Semicond., Nijmegen, Netherlands
fYear :
1998
fDate :
March 31 1998-April 2 1998
Firstpage :
370
Lastpage :
377
Abstract :
This paper addresses the question of under what conditions burn-in can be eliminated. Based on data of more than 30 million sold devices, the effect of screening of latent defects at electrical test on product reliability has been investigated. The results are combined with the yield-reliability relation and an experimentally determined failure rate time evolution, yielding a model that allows determination of the sense or nonsense of burn-in or screens at electrical test quantitatively. The model predictions are in good agreement with experimental data. Furthermore, for typical operating conditions, high yielding batches show a better long term reliability than low yielding batches even if the latter have been subjected to burn-in. It is also shown that voltage stresses, distribution tests and IDDQ screens can be good alternatives to burn-in.
Keywords :
failure analysis; integrated circuit modelling; integrated circuit testing; integrated circuit yield; production testing; IDDQ screening; batch yield; burn-in; burn-in elimination; distribution tests; electrical test; failure rate time evolution; latent defect screening; latent defects; long term reliability; model predictions; operating conditions; product reliability; voltage stresses; yield-reliability relation; BiCMOS integrated circuits; Circuit testing; Costs; Integrated circuit reliability; Integrated circuit yield; Manufacturing; Predictive models; Stress; TV; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International
Conference_Location :
Reno, NV, USA
Print_ISBN :
0-7803-4400-6
Type :
conf
DOI :
10.1109/RELPHY.1998.670671
Filename :
670671
Link To Document :
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