On correlating structural tests with functional tests for speed binning of high performance design

Author

Zeng, J. ; Abadir, M.S. ; Vandling, G. ; Wang, L.-C. ; Karako, S. ; Abraham, J.A.

Author_Institution

Freescale Semicond. Inc, Austin, TX, USA

fYear

2004

fDate

9-10 Sept. 2004

Firstpage

103

Lastpage

109

Abstract

The use of functional vectors has been an industry standard for speed binning of high-performance ICs. This practice can be prohibitively expensive as ICs become faster and more complex. In comparison, structural patterns target performance related faults in a more systematic manner. To make structural testing an effective alternative for speed binning, this paper investigates the correlation between functional test frequency and the test frequencies of various types of structural patterns on MPC7455, a Motorola microprocessor compatible to PowerPC™ instruction set architecture.

Keywords

automatic test pattern generation; fault diagnosis; instruction sets; integrated circuit testing; microprocessor chips; MPC7455; Motorola microprocessor; PowerPC instruction set architecture; functional test frequency; functional tests; functional vectors; high-performance IC; performance related faults; speed binning; structural patterns; structural test correlation; structural testing; Accuracy; Automatic test pattern generation; Cost function; Delay; Frequency; Microprocessors; Semiconductor device measurement; System testing; Timing; Velocity measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocessor Test and Verification (MTV'04), Fifth International Workshop on

ISSN

1550-4093

Print_ISBN

0-7695-2320-X

Type

conf

DOI

10.1109/MTV.2004.17

Filename

1563080