Title :
Lossy transmission line effects in a thin-film multichip module
Author_Institution :
Toshiba Corp., Tokyo, Japan
Abstract :
The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced
Keywords :
CMOS integrated circuits; buffer circuits; circuit analysis computing; hybrid integrated circuits; thin film circuits; transmission lines; CMOS interface; CMOS-based multichip modules; MCM; SPICE simulation; chip-on-wafer technology; chip-to-chip signal propagation properties; emitter-coupled logic interface; line resistance; loss transmission line effects; multichip modules; power dissipation; thin-film multichip module; Analytical models; CMOS logic circuits; CMOS technology; Multichip modules; Power dissipation; Power transmission lines; Propagation losses; SPICE; Transistors; Transmission lines;
Conference_Titel :
Circuits and Systems, 1991., IEEE International Sympoisum on
Print_ISBN :
0-7803-0050-5
DOI :
10.1109/ISCAS.1991.176838
