• DocumentCode
    2834606
  • Title

    Performance driven layout of thin-film substrates for multichip modules

  • Author

    Dai, Wayne Wei-Ming

  • Author_Institution
    Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
  • fYear
    1991
  • fDate
    11-14 Jun 1991
  • Firstpage
    2308
  • Abstract
    The author addresses some of the problems encountered in propagating high-speed signals on lossy transmission lines of thin-film substrates for multichip modules. With the flexibility of rubber-band routing and the efficiency of a dynamic data representation based on constrained Delaunay triangulation, lossy and unterminated transmission lines can be generated that successfully propagate high speed signals. A substrate layout system, named SURF, is being developed for thin-film multichip module (MCM) substrate design
  • Keywords
    circuit layout CAD; hybrid integrated circuits; thin film circuits; transmission lines; MCM; SURF; constrained Delaunay triangulation; dynamic data representation; high speed signals; lossy transmission lines; multichip modules; performance driven layout; rubber-band routing; substrate layout system; thin-film substrates; unterminated transmission lines; Frequency; Integrated circuit interconnections; Multichip modules; Packaging; Power system interconnection; Printed circuits; Propagation losses; Substrates; Transistors; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1991., IEEE International Sympoisum on
  • Print_ISBN
    0-7803-0050-5
  • Type

    conf

  • DOI
    10.1109/ISCAS.1991.176839
  • Filename
    176839