DocumentCode
283530
Title
A CAL package to link semiconductor process engineering and ECAD
Author
Stevens, Paul R C ; Noras, James M.
Author_Institution
Dept. of Electr. Eng., Bradford Univ., UK
fYear
1988
fDate
32447
Firstpage
42552
Lastpage
42553
Abstract
Chip design is moving away from simple gate array implementation, in which device parameters and performance are pre-determined, towards semi- or full-custom implementation. Semiconductor processing is the basis of IC design, and it is important that engineers be educated in the properties of their raw materials. The trend towards more fully customised designs puts a premium on accurate knowledge of design parameters and of the origin of design rules. The authors have assembled a package of public domain programs for process simulation and device parameter extraction with graphical output
Keywords
application specific integrated circuits; circuit CAD; digital simulation; IC design; design parameters; design rules; device parameter extraction; full-custom implementation; graphical output; process simulation; public domain programs; semicustom;
fLanguage
English
Publisher
iet
Conference_Titel
Custom VLSI Design and Test, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
209550
Link To Document