DocumentCode :
2835958
Title :
Signal integrity check by simulation to improve PCB performance
Author :
Solanki, Sudarshan D. ; Kumaraswamy, Ravishankar
Author_Institution :
Wipro Technol., Bangalore, India
fYear :
2003
fDate :
18-19 Dec. 2003
Firstpage :
69
Lastpage :
76
Abstract :
Day by day the product cycles are shrinking in order to achieve time to market advantage. The project plans are made based on implicit assumption that the prototype boards will be fully functionally correct and ready for pre-qualification testing and very little change happens from prototype to production board. This has made it imperative that we come up with board designs which are right in first pass itself. Today´s board designs are becoming quite complex due to high speed interfaces and shrinking product dimensions. This paper presents the importance of signal integrity and crosstalk simulation in achieving single pass success for today´s boards. The paper presents a case study of a fairly complex telecom board done by WIPRO. It is also important to note that the signal behaviour predicted by computer aided engineering (CAE) tools pretty well matches the signals captured on the board and hence provides a lot of confidence and reasoning behind doing such exercise.
Keywords :
circuit optimisation; circuit simulation; computer aided engineering; crosstalk; printed circuit testing; CAE tools; PCB performance; WIPRO; computer aided engineering; crosstalk simulation; high speed interfaces; prequalification testing; prototype boards; shrinking product dimensions; signal behaviour; signal integrity check; time to market; Cities and towns; Computational modeling; Computer aided engineering; Consumer electronics; Crosstalk; Predictive models; Prototypes; Testing; Time to market; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Interference and Compatibility, 2003. INCEMIC 2003. 8th International Conference on
Print_ISBN :
81-900652-1-1
Type :
conf
DOI :
10.1109/ICEMIC.2003.1287764
Filename :
1287764
Link To Document :
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